Catalog Description:
Introduction; overview of Micro
Electromechanical Systems (MEMS) and microsystems. Working principles of
microsystems. Engineering science and engineering mechanics topics for
microsystem design and fabrication. Application of thermofluid engineering
principles in microsystems design. Scaling laws and miniaturization. Materials
for MEMS and microsystems. Microsystem manufacturing processes. Microsystem
design and packaging..
Course Objectives:
The objective of this course is to teach students the fundamental knowledge
(design, manufacture and packaging) of Micro Electromechanical Systems and
microsystems, which have applications in the aerospace, automotive,
biotechnology, consumer products, defense, environmental protection and safety,
healthcare, pharmaceutical, and telecommunications industries.
Prerequisites:
Consent of the Department
Textbook(s):
MEMS & Microsystems, Design and Manufacture, Tai-Ran Hsu, McGraw-Hill, 2002, ISBN: 0-07-113051-9.
References:
1.Microsensors, MEMS and Smart Devices
Julian W. Gardner, Vijay K. Varadan, Osama O Awadelkarim
John Wiley and Sons, 2001, ISBN: 0-471-86109-X.
2.An Introduction to Microelectromechanical Systems Engineering
Nadim Maluf
Artech House, Inc., 1999, ISBN: 0890065810.
3.Nano- and Microelectromechanical Systems: Fundamentals of Nano- and Microengineering
Sergey Edward Lyshevski
CRC Press, 2000, ISBN: 0849309166.
4.The MEMS Handbook
M. Gad-El-Hak (Editor)
CRC Press, 2001, ISBN: 0849300770.
5.Mechanical Microsensors
M. Elwenspoek, R. Wiegerink
Springer-Verlag, 2001, ISBN: 3540675825.
6.Micromachined Transducers Sourcebook
G. T. A. Kovacs
McGraw-Hill, 1998, ISBN: 0-07-290722
Syllabus:
Week Lecture Topics
1 Overview of microsystems and the evolution of microfabrication.
Preview of the current and potential markets for various types of microsystems.
2 Working principles of currently available microsensors, actuators and motors,
valves, pumps, and fluidics used in microsystems.
3 Engineering science topics applicable to microsystems design and fabrication.
4,5 Engineering mechanics topics relevant to microsystem design and packaging.
· Mechanics of deformable solids and mechanical vibration theories.
· Basic formulations of thermomechanics and fracture mechanics of interfaces
of thin films that are common in microstructures.
· Outline of the finite element method for stress analysis.
6 Application of thermofluid engineering principles in microsystems design.
7 Scaling laws that are used in the conceptual design of microdevices and
systems.
8,9 Materials used for common microcomponents and devices.
· Active and passive substrates, packaging materials.
· Materials ( piezoresistives, piezoelectrics, and polymers) for microsystems.
10,11 Microfabrication processes for micromanufacturing.
12 Common micromanufacturing techniques: bulk manufacturing, surface
micromachining, and the LIGA process.
13,14 Essential elements involved in the design and packaging of microsystems.
· The use of CAD and the finite element method.
· Case studies and examples in the design and packaging of micro pressure
sensors and fluidics.
Homeworks, Quizzes, Projects:
Computer Usage
For the time being, computer usage is expected in preparation of term projects, since the software (Cadence, CoventorWare (MEMCAD),MEMSCAP, ANSYS, …) for MEMS applications is not available in the Mechanical Engineering Department. At the beginning, studies will be made by making use of conventional CAD software. After acceptance of the course, necessary efforts will be given for purchase of both software and hardware. Meanwhile demonstrations will be made by making use of METU-MET Facilities.Final goals is the purchase of basic MEMS fabrication equipment.
Laboratory Work:
Category Content:
Engineering science (0.5 credits)
Engineering design (1.5 credits)
Departmental (1 credit)
Instructors:
Prof. Dr. M. A. Sahir ARIKAN